The equipment has automatic loading and unloading functions, which improves production efficiency and consistency
Optional automatic analysis and addition device for tank solution to ensure the stability and consistency of the electroplating process
The uniformity ability of copper electroplating reaches a range of R<+-10% and Covi<8%, ensuring the consistency of electroplating quality
Excellent performance in handling thin sheet materials, improving production efficiency, and ensuring electroplating quality, suitable for various circuit board manufacturing needs
Classification of Process Flow
Spot plating and hole filling: After copper deposition and full board electroplating, the surface is covered with a dry film and blind holes are opened for local hole filling and electroplating to achieve precise filling.
Whole board hole filling: After copper deposition, specialized solution is directly used for full board electroplating hole filling, which is lower in cost and higher in yield.
Mechanism of plating solution action
In the sulfate system solution, high concentration copper sulfate (providing Cu ² ⁺) works synergistically with low concentration sulfuric acid (improving conductivity), combined with chloride ions (40-60ppm) to optimize coating stress.
The additive combination (brightener/inhibitor/leveler) inhibits copper deposition on the surface of the board through a competitive adsorption mechanism, accelerating the copper plating rate at the bottom of blind holes to achieve superfilling.
Key equipment module
Horizontal PTH electroplating line: Integrated constant current rectifier and liquid circulation system to ensure the exchange capacity of liquid in blind holes. The AR ratio (aperture aspect ratio) must be strictly controlled within 1.2:1.
Tension control system: prevents deformation of the coil and ensures drilling accuracy of 0.3-0.4mm blind hole depth (± 0.05mm)
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